Placed in room Q156, Nano-process lab.
Low power descum and residuals removal.Soft-etching technology: precision RF power (<30 W) with etch power down to 1 Wand control resolution 1 W. Parallel plate RF etcher.
Unprotected surfaces of the following materials are not allowed: glasses, noble metals (Au, Ag, Pt, Cu, Pd), heavy metals (Cd, Pb, Zn) and certain types of polymers (e.g. silicones).