Table-top Ion Wave 10 microwave plasma system from PVA TePla America. The system is primarily designed for isotropic etching of Si, SiO2, and polymers (resists) with minimum ion damage to samples. Three process gases are available: O2, Ar and CF4. The water cooled plate can accomodate wafers with diameters up to 6 inches. Plasma excitation: MW (2.45 GHz, up to 1000W).
Location: Room Q156, Nano Process EBL-Lab (Cleanroom Level 1).