The Chemical Mechanical Polisher (CMP) tool intended for use for the de-layering of thin films, device layers or 
blanket depositions and associated processes. It can also be used for substrate wafer processes. 

With adjustable and programmable carrier speed, rotation direction, download and backing pressure, plate speed and direction, as well as slurry feed rate.

Sample dimensions at the moment are 10x8mm coupons, 2"  and 4" wafers. Other options can be available but require planning and purchasing of parts. Sizes up to 8" wafers can eventually be processed on this tool, after procurement of eventual needed parts.

Slurry used is SF1 which is a silicon dioxide(amorphous) based. Other slurries available for purchase.

Located in CBE lab Q231