Picture of ALD - Beneq TFS 200
Current status:
AVAILABLE
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1st Responsible:
Process:
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Main application: Deposition thin high-k oxide layers

Materials: HfO2, ZrO2, Al2O3

8" max wafer diameter

The ALD is equipped with a plasma-head that allows the used of O2 and N2 plasma.

4 precursors currently installed:

  • Hafnium (Cp-Hf, Booster).
  • Zirconium (Cp-Zr, Booster).
  • Water.
  • Aluminum (TMA)
Tool name:
ALD - Beneq TFS 200
Area/room:
Q256: Aixtron 200 / XRD
Category:
CVD equipment
Manufacturer:
Benq
Model:
TFS 200

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